Izinto zikagesi zizophehla ukushisa uma zisebenza.Ukushisa akulula ukuqhuba ngaphandle kwemishini, okwenza ukushisa kwangaphakathi kwemishini kagesi kukhuphuke ngokushesha.Uma kuhlale kunendawo yokushisa ephezulu, ukusebenza kwemishini kagesi kuzolimala futhi impilo yesevisi izoncishiswa.Shayela lokhu kushisa okwedlulele ngaphandle.
Uma kuziwa ekwelashweni kokukhishwa kokushisa kwemishini ye-elekthronikhi, ukhiye wuhlelo lokwelapha lokukhipha ukushisa lwebhodi lesifunda le-PCB.Ibhodi lesekethe le-PCB liwukusekela kwezingxenye ze-elekthronikhi kanye nesithwali sokuxhunywa kukagesi kwezingxenye ze-elekthronikhi.Ngokuthuthuka kwesayensi nobuchwepheshe, okokusebenza kwe-elekthronikhi nakho kuyathuthukela ekuhlanganisweni okuphezulu kanye nokwenza kancane.Ngokusobala akwanele ukuthembela kuphela ekulahlekeni kokushisa okungaphezulu kwebhodi lesifunda le-PCB.
Lapho uklama isikhundla sebhodi lamanje le-PCB, unjiniyela womkhiqizo uzocabangela okuningi, njengalapho umoya ugeleza, uzogeleza kuze kube sekugcineni ngokumelana okuncane, futhi zonke izinhlobo zokusetshenziswa kwamandla kagesi kufanele zigweme ukufaka imiphetho noma amakhona, ukuze kuvinjwe ukushisa ukuthi kungadluliselwe ngaphandle ngesikhathi.Ngokungeziwe ekwakhiweni kwesikhala, kuyadingeka ukufaka izingxenye zokupholisa zezingxenye ze-elekthronikhi ezinamandla amakhulu.
I-Thermally conductive gap filling material iyisixhumi esibonakalayo esisebenza kakhulu esigcwalisa i-thermal conductive material.Lapho izindiza ezimbili ezibushelelezi neziyisicaba zithintana, kusekhona izikhala.Umoya osegebeni uzovimbela isivinini sokuqhuba ukushisa, ngakho-ke izinto zokugcwalisa igebe elishisayo zizogcwaliswa kurediyetha.Phakathi komthombo wokushisa nomthombo wokushisa, susa umoya esikhaleni futhi unciphise ukumelana nokushisa kokuxhumana kokuxhumana, ngaleyo ndlela kwandise isivinini sokushisa kokushisa kurediyetha, ngaleyo ndlela unciphise izinga lokushisa lebhodi lesifunda le-PCB.
Isikhathi sokuthumela: Aug-21-2023